I would suggest that you keep the wafers wet out of your polishing
operation, then mechanically scrub the wafers using either a polyvinyl
alcohol sponge or a nylon brush, with the aid of a surfactant and at a pH
of about 8.5 using amonia to raise the pH.  Then rinse and spin dry.  We
have automated systems that do all of that, but if your quantities are low
you can do the process manually.

Gary Hillman
Service Support Specialties, Inc.
9 Mars Court
PO Box 365
Montville, NJ 07045
973-263-0640
973-263-8888.



-----Original Message-----
From:   Yilei Zhang [SMTP:[email protected]]
Sent:   Monday, July 19, 2004 8:18 PM
To:     [email protected]
Subject:        [mems-talk] wafer post polish cleaning

Hi colleagues:
Can anybody provide info. about the post cleaning process to remvoe
particles
after wafer polishing? I ued colloidal silica polishing subspension to
polish
my wafer with 2um silica layer. I just want to remove a very thin layer of
silica, not all the silica layer. After polishing, there are lots of
particle
left, which cannot be removed by ultrasonic cleaning with Acetone. Any
suggestion will be appreciated.

Regards,
Yilei Zhang







_______________________________________________
[email protected] mailing list: to unsubscribe or change your list
options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk
Hosted by the MEMS Exchange, providers of MEMS processing services.
Visit us at http://www.memsnet.org/