Dear all,
We are developing a silicon rich LPCVD nitride process for 12" substrates.
The primary reason for this process is for wet etch resistance and the
ability to deposit thicker LPCVD films. My question to you is can we also
provide material for cantilevers to the MEMS community with the same
process. is the overall tensile stress the same as the stress gradient for
cantilevers.

Best Regards,

Glenn