Have anyone worked on building an integrated circuit or a MEMS without using
a complete clean room for all processes (just a clean process in a filtered
air positive pressure room)?



Of course the yield may be very low since many dust particles will drop into
wafer's surface but I wonder if it will remain high enough to allow process
technology test and development (not production).



The porpouse of this question is to build argumentation in a discussion
regarding potential positive results when building a very low cost facility
for first steps in microelectronics' process technology development and
training.

Thanks in advance,



Augusto Einsfeldt