Hello Michael,

My name is Chris Storment, I'am responsible for MEMS fabrication and
process development at Stanford University. We have a PECVD tool that
can deposit low stress (<100MPa tension) and low temperature (350°C)
silicon nitride films. As long as the chips aren't mounted with PB/Sn or
In based solders or organic adhesives that are thermally unstable at
350°C (we have successfully used 350°C cured polyimides for example)
then there should be no problems. I would be happy to do one trial run
on a sample to see if the process will work for you. Just let me know
what materials are being used on the wafer or chips and the name or
composition of the adhesive/bonding agent.

Look forward to hearing from you,

Chris Storment
(650) 725-7268
[email protected]