Do a thin chromium layer under the deposited gold. Cr will serve as the
adhesion layer between Au and Si.

_________________________________
Elina Kasman
Product Development Engineer
Optobionics Corporation
850 E. Diehl Rd., Ste 120
Naperville, IL 60563
direct: 630-245-0626
email: ekasman@optobionics.com


-----Original Message-----
From: mems-talk-bounces@memsnet.org
[mailto:mems-talk-bounces@memsnet.org] On Behalf Of Chen-Han Lee
Sent: Tuesday, August 31, 2004 9:07 AM
To: Mems-Talk
Subject: [mems-talk] adhesion between Si wafer and gold film





Dear all,

could anyone help me please.
I am doing some electroplating using SU-8 mould.
gold is evaporated before SU-8 is deposited.
after the developing step,
many SU-8 parts fall off of the wafer with gold film attached to them,
how do i improve the adhesion between Si and the gold film, so that i
have a a complete patterned wafer??

thanks for the help.

Chen han

///////////////////////////////////
Chen-Han Lee
Research Student
School of Manufacturing and Mechanical Engineering,
University of Birmingham,
Birmingham, B15 2TT
United Kingdom,
Phone :  +44 121 4144245
Fax :    +44 121 4143958
E-Mail : dcl815@bham.ac.uk
///////////////////////////////////


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