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MEMSnet Home: MEMS-Talk: Re: Source for SOI wafers, wafer bonding source, etc.
Re: Source for SOI wafers, wafer bonding source, etc.
1998-11-18
Bill Stockdale/John Baker
1998-11-19
Y. K. Kim
1998-11-19
Christopher Bang
1998-11-20
Klaus Ruhmer
1998-11-19
Y. K. Kim
Re: Source for SOI wafers, wafer bonding source, etc.
Bill Stockdale/John Baker
1998-11-18
Adam -

We produce thin, flat glass wafers.  Our wafers have superior bonding
capablities.  Please contact me at 630-365-9645 phone, 630-365-9643 fax or
[email protected].

Thank you for your inquiry,

Kris Burgeson
Sensor Prep Services

Adam Cohen wrote:

> Dear Colleagues,
>
> We are seeking a source for a small quantity of SOI wafers with a Si
> thickness of about 50 microns for deep silicon RIE. We would prefer 4"
> diameter wafers, but other sizes may be acceptable. Substrate/overall
> thickness should be as large as possible.
>
> As an alternative to these, we are considering bonding a 50-micron Si wafer
> to glass. Does anyone know good sources for thin wafers and flat glass
> substrates, and someone who can do the bonding?
>
> If anyone has any leads, we'd much appreciate it.
>
> Thanks very much,
>
> Adam Cohen
> University of S. California
>
>


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