Hi

try an underlayer of say Chrome or Titanium. Also make sure you clean your
silicon before deposition

Dr. Michael Cooke
Microsystems Technology Group
School Of Engineering
University of Durham
Durham
DH1 3LE
Phone: +44 (0)191 3342535
Fax:      +44 (0)191 3342407
Email:   m.d.cooke@physics.org
Webpage Http://www.dur.ac.uk/microsystems.technology
----- Original Message -----
From: "Chen-Han Lee" 
To: "Mems-Talk" 
Sent: Tuesday, August 31, 2004 3:07 PM
Subject: [mems-talk] adhesion between Si wafer and gold film


>
>
>
> Dear all,
>
> could anyone help me please.
> I am doing some electroplating using SU-8 mould.
> gold is evaporated before SU-8 is deposited.
> after the developing step,
> many SU-8 parts fall off of the wafer with gold film attached to them,
> how do i improve the adhesion between Si and the gold film,
> so that i have a a complete patterned wafer??
>
> thanks for the help.
>
> Chen han
>
> ///////////////////////////////////
> Chen-Han Lee
> Research Student
> School of Manufacturing and Mechanical Engineering,
> University of Birmingham,
> Birmingham, B15 2TT
> United Kingdom,
> Phone :  +44 121 4144245
> Fax :    +44 121 4143958
> E-Mail : dcl815@bham.ac.uk
> ///////////////////////////////////
>
>
>
>