Different expansion coefficients, since the cracks are caused by curing.

Perhaps the polyimide is causing this
Have you tried a buffer layer that will absob the extra stress due to
heating?

-----Original Message-----
From: [email protected]
[mailto:[email protected]] On Behalf Of Aamer Mahmood
Sent: Tuesday, August 31, 2004 9:50 AM
To: [email protected]
Subject: [mems-talk] Deposition of thick SiO2 layer


Hello all,
I have deposited ~ 2-3um of SiO2 on a polyimide (PI2610). Subsequent
process steps require curing @ ~ 265 C. I notice big cracks in the Oxide
and also large chunks of it just peel off. Before resorting to
sputtering, I have also tried spin-on-glass but faced similar problems.
Any suggestions on the cause and/or remedy would be greatly appreciated.
Thanks.

Aamer Mahmood
Grad Res Assist
Microsensors lab
UT Arlington

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