Adam,

Try:
Bondtronix, Inc.
Michael Boyle
925-947-2664

Regards,
Klaus Ruhmer

-----Original Message-----
From: Adam Cohen 
To: MEMS@ISI.EDU 
Date: Wednesday, November 18, 1998 12:52 PM
Subject: Source for SOI wafers, wafer bonding source, etc.


>Dear Colleagues,
>
>We are seeking a source for a small quantity of SOI wafers with a Si
>thickness of about 50 microns for deep silicon RIE. We would prefer 4"
>diameter wafers, but other sizes may be acceptable. Substrate/overall
>thickness should be as large as possible.
>
>As an alternative to these, we are considering bonding a 50-micron Si wafer
>to glass. Does anyone know good sources for thin wafers and flat glass
>substrates, and someone who can do the bonding?
>
>If anyone has any leads, we'd much appreciate it.
>
>Thanks very much,
>
>Adam Cohen
>University of S. California
>
>
>