All,
I am looking for a selective material removal process
(microetching/micromachining/micromilling) on faces of lapped flat and polished
rings made of SiC or WC.
Typical depth of pockets is 3-5 microns.
Typical pocket size is 3x3 up to 6x6 mm.
The pockets are equally spaced around the ring face.
If anyone has any idea what-so-ever (laser, plasma, ion milling...) please
advise.
Thanks.