Hi everbody,

who could give me the most straightforward receipe to electroplate Cu
on Si wafer
1) which seed layer, Ti and Gold? is Ti or CR usufefull for adheison
properties?
2) which electrplating solution and which current density?

thanks



Dr Laetitia Philippe
Electrochemistry and Micro-patterning Group
EMPA

Feuerwerkstrasse 39
CH-3602 Thun

Tel 41 (0)332285249