Commonly used adhesion layers for other metals are Cr, Ti, and 10Ti/90W.
Al and its alloys (e.g., Al/2Si, Al/2Si/4Cu) also stick well.
In addition, I've found experimentally that the following stick and pass the
tape test: V, Nb, Ta, Mo, NiCr.
I believe that Ni/V, Zr, and Hf have also been used.
You can see the trend on the periodic table of most of the elements in
Columns IVA, VA, and VIA having good adhesion (except for W),
while the elements in VIIIA (Ni, Pd, Pt) and 1B (Cu, Ag, Au) usually require
an adhesion layer.
    --Kirt Williams

----- Original Message -----
From: "Federico" 
To: 
Sent: Tuesday, September 28, 2004 3:35 AM
Subject: [mems-talk] sputter materials on Si02


> Hi everybody
>
> There is anyone that could tell me which materials have the best adhesion
> properties for sputter on SiO2?
>
> thanks
> Federico
>
> _______________________________________________
> MEMS-talk@memsnet.org mailing list: to unsubscribe or change your list
> options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk
> Hosted by the MEMS Exchange, providers of MEMS processing services.
> Visit us at http://www.memsnet.org/