Brijesh,

It depends on what kind of information you are looking for in WLP.  Its actually
a pretty large field, and can include processes for wafer bumping and flip chip
packaging (where the primary processes are lithographic and plating) to full
wafer level bonding.

A reference listed previously in this forum has some good basic information on
wafer level bonding:

Fundamentals of Microfabrication
by Marc Madou



Best Regards,
Chad Brubaker

EV Group       invent * innovate * implement
Technology - Tel:  480.727.9635, Fax:  480.727.9700  e-mail:
[email protected], www.EVGroup.com

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 -----Original Message-----
From:   [email protected] [mailto:[email protected]]  On
Behalf Of Brijesh Raut
Sent:   Tuesday, September 28, 2004 9:56 AM
To:     'General MEMS discussion'
Subject:        [mems-talk] wafer level packaging



hi everybody,

I am very new to wafer level packaging(WLP) and wafer bonding in MEMS
technology, so can any one assist me to find the basic concept and ideas for
WLP.

sincerely
brijesh


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