Hi,

I am trying to coat a 1mm thick su-8 film.

(# A new fabrication process for ultra-thick microfluidic
microstructures utilizing SU-8 photoresist #)
(http://mml.es.ncku.edu.tw/study/ Result/9-page/SU-8_che-hsin.pdf)


1. coating process

Accoding to the journal , the teflon scraper used to spread the su-8
film at a temperature of 80 degree celcius. ( After pouring the su-8
on the substrate )
So , is that means do it on the hot plate?
And what is this step for? ( Since the su-8 will self-planarized
during baking process )

2. develope process

"the substrates were developed using pure PGMEA with gentle ultrasonic
agitation and then baked at 90 degree celcius for 10 mins to remove
the residue organic solvent."

there is a few button on the ultrsonic agitator
temperature , time , ultrasonic (low , middle ,high).

does it mean develope the unwanted su-8 in ultrasonic bath with PGMEA
at 90 degree celcius for 10 min?

Or does it mean developed in the ultrasonic agitator and then baked on
th hot plate at 90 degree celcius for 10 mins?

confuse :(


thanks in advance.

best rgds,
patrick