hello,

   Lift off would be a better option for this kind of
problems,as you will not be needing any kind of wet
etchant.

 If you prefer sticking by the previous method,I
suggest you hard bake the photoresist at a temperature
of 130 deg C for about 10-15 min. Later i also suggest
that you descum using oxygen plasma.This should work
for you.

Regards,
Rakesh Katragadda
Graduate Researcher
Wayne state university

--- Vivek Mukhatyar  wrote:

> I was trying to spin coat aluminium with shipley
> 1818 negative resist.
>  But when I used a wet etching solution the resist
> wasn't able to
> withstand the etchant.  My patterns are on the scale
> of microns and
> the best way to etch is through wet etching because
> i need to remove
> alomost 300 micron thick aluminum.  Does anyone know
> the steps to spin
> a thick layer of resist that will withstand the
> etchant that is made
> up of Hcl and CuCl2.  I have SU-8 and 1818 to my
> disposal.  I also
> need to remove the resist after the etching process.
>
> Thank you,
>
> Vivek Mukhatyar
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