Jack,
If you are plating Cu on Cu seed layer that is oxidized by exposure to air
and humidity and you are using copper sulfate solution, you do not need to
take special steps to use any cleaning solution e.g. dilute sulfuric or
hydrochloric acid. Actually, excessive cleaning may lead you to loss of
copper seed layer. Your copper sulfate solution is already up to 5% or more
sulfuric acid anyway so the oxide will be removed after few seconds upon
immersion. You do need a good mixing, however, to ensure good exchange of
matter befor and during plating. Copper oxide is too many times blamed for
other more serious inadequacies such as resist leftovers, organic
contamination, faulty plating parameters and mixing conditions.
Igor Kadija
www.fibrotools.com




----- Original Message -----
From: "Jack Peng" 
To: 
Sent: Monday, October 18, 2004 1:09 PM
Subject: [mems-talk] seed layer for nickel elctroplating


> Hi Sreeram,
>         I am trying to plate copper on top of chrome and copper. I am
> worried about oxidation of the copper seed layer before plating. Should I
> treat the copper seed layer with some chemical?
>         Thanks.
>
> Jack
>
>
>
>
> ---original message----
> Hey Ashari
>
>    Aluminum is soluble in both acidic and basic solutions and is not an
> ideal seed layer. The typical seed layer used for electroplating is
titanium
> followed by copper.
>
>    Regards
>    Sreeram
>
> -----Original Message-----
> From: mems-talk-bounces+sappasam=ececs.uc.edu at memsnet.org
> 
> [mailto:mems-talk-bounces+sappasam=ececs.uc.edu at memsnet.org
>  ] Sent:
Tuesday,
> December 16, 2003 2:59 AM
> To: mems-talk at memsnet.org
> 
> Subject: [mems-talk] seed layer for nickel elctroplating
>
> Is there a way to electroplate nickel onto aluminium
> coated wafer as im unable to do so currently. Whats
> the best seed layer for nickel electroplating.
>
> =====
> ashari keling
>
>
>
>
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