Dear all,

When I preformed a plasma etching, i,e.,using CF4 etched Silicon Nitride
(100nm) on top of silicon and the photo resist (OCG825) as a masking layer, I
had a problem that the PR re-deposited to the opened (silicon) area. Under
microscope, the opened (silicon) areas looked like light red. How can I get
rid of this problem? Any advise are appreciated! BTW, my etcher is Technics
West Inc., PE II-A Plasma System.

Have a nice day!

Lydia


-------------------------------------------------
This mail sent through IMP: http://horde.org/imp/