You may want to try a packaging house to bond gold wires to the metal,
and apply their standard test for bond strength. The usual test is M2011
(bond pull). If the metal does not adhere well, it will delaminate from
the surface before the wire breaks.

Regards,
Pierre x286
-----Original Message-----
From: [email protected]
[mailto:[email protected]] On Behalf Of Krasniansky Vladimir
Sent: November 3, 2004 08:11
To: [email protected]
Subject: [mems-talk] Plated gold adhesion measurements

Hi all,
If anyone know how should be measured adhesion of plated metal to
substrate?


Sincerely,

Vladimir Krasniansky,

Process Engineer,

Gal-El (MMIC);

100, Yitzhak Hanassi Blvd., P.O. Box 330 Ashdod 77102, ISRAEL.

Tel 972-8-857-2436/4

Fax 972-8-857-2658







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