On Nov 2, 2004, at 5:04 PM, Aravind wrote:
> Hello All,
> I am just looking to find out what methods you guys
> use to remove the PDMS mold from silicon wafers that
> has shapes ethced onto it.


We have successfully used either:

1)a brief CHF3 plasma treatment of the micromachined silicon surface in
a small RIE chamber. This deposits a thin "teflon-like" release layer,
or

2) treatment by putting the silicon wafer in a dessicator with a small
beaker containing a few drops of
tridecafluoro-1,1,2,2-tetrahydooctyl)trichlorosilane. Pump on the
dessicator with a small lab pump.

Jim
>
303-497-5989