Dear mems talkers,

we have a RIE chamber with temperature control of the 3" carrier wafer.
Since we are just using
 waferpieces we just place these on top of the carrier wafer. It seems
now that these small pieces
 do not have proper thermal contact to the chuck, so the temperature of
the sample is not constant
 from etch to etch and the etch rate also varies by 50per cent...

Do you have any suggestions how to provide good thermal contact? The
manufacturer suggested
Fomblin vaccuum oil, but it is impossible to remove it from the samples
after etching...

I appreciate any help! Have a nice day,

Karin


--
Dipl.-Ing. Karin Buchholz
Walter Schottky Institut
Technische Universitaet Muenchen