Hi Craig,

the easiest should be a standard backgrinding process. 300µm wafers are
still thick enough to allow standard handling. No nasty chemicals will be
required.

Practical concerns:
1) You will have to apply a standard backgrinding tape to protect the
sensitive wafer front side.
2) As wafer strength and die strength will decrease due to stress induced by
the grinding process, you might consider a wafer polish after grinding, e.g.
by means of a CMP step. The thinner the wafers, the more important the
polish will be to regain die and wafer strength. Ideally, avoid wafer
handling between grinding and polish by grinding and polishing on the same
chuck.

Please contact me directly for more information
Best regards / Mit freundlichen Grüßen

Thilo Semperowitsch
(Sales Eng. Dicer & Grinder
     Central Europe)

ACCRETECH Europe GmbH
Landsbergerstr. 396
D-81241 Munich, Germany
Tel:  +49/89/546788-39
Fax: +49/89/546788-10
mailto:SemperowitschT@accretech.de 
http://www.accretech.jp 

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