Dear all,

I made a device comprising a layer of electroformed Ni (20um) and a
layer of SU8 (30um). After releasing the device (20mm x 1.5mm)
it shows significant bending of several mm from one side to the other.

Could anyone of you give me some advice how to reduce the bending
(which probably comes from internal stress in the laminate).

Would thermal cycling relieve the stress and reduce the bending?

Any help is appreciated.

Thanks and Merry Christmas,
Juergen

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