A MEMS Clearinghouse® and information portal
for the MEMS and Nanotechnology community
RegisterSign-In
MEMSnet Home About Us What is MEMS? Beginner's Guide Discussion Groups Advertise Here
News
MEMSnet Home: MEMS-Talk: Re: DRIE etching on Silicon bonded to PYREX wafer
Re: DRIE etching on Silicon bonded to PYREX wafer
2005-02-18
Marco Doms
Re: DRIE etching on Silicon bonded to PYREX wafer
Marco Doms
2005-02-18
Badin,

I use the same tool for the same process (300 um silicon bonded on 500 um
Pyrex). You can use clariant AZ6632 (1500 rpm, >5um)  or AZ9260 (2000rpm,
>10um) photoresist and your standard recipes for this kind of process. The
resist will withstand up to 2 hours of processing with 600W coil and 14W platen
power when using an SF6/O2 process. If you have to use a handle wafer due to
holes in your pyrex wafer, you should use AZ6632 with 500rpm (plus EBR or
1500rmp for 1s) and a postbake at 125 °C, furthermore you should decrease the
coil power to 300 - 350 W.
Contact me for any more information.

Marco
reply
Events
Glossary
Materials
Links
MEMS-talk
Terms of Use | Contact Us | Search
MEMS Exchange
MEMS Industry Group
Coventor
Harrick Plasma
Tanner EDA
Nano-Master, Inc.
Harrick Plasma, Inc.
MEMS Technology Review
Addison Engineering