Hi,

Sorry, I didn't see the original post just a reply to it so my apologies if
what I suggest is not suitable...

You could try to use an electrophoretic photoresist such as PEPR 2400 or
Eagle 2100 (positive and negative, respectively). What you have to do is
coat your surface in a conductive layer and electroplate the photoresist
directly on top. Adhesion along developed feature edges is sometimes an
issue, however, reproducible conformal coatings are possible. If protection
is required for etching, your newly patterned seed layer could be used as
Eagle is not very resilient (don't know about PEPR). Let us know how you get
on.

Regards,

Michael