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MEMSnet Home: MEMS-Talk: Adhesion for Al
Adherence of Ti/Au films
2005-04-10
natacha smetana
2005-04-11
Brent Garber
2005-04-14
Jiang Ziling
2005-04-11
Wilson, Thomas
2005-04-11
Alain
Adhesion for Al
2005-04-14
Andrew Xiang
2005-04-14
Jiang Ziling
2005-04-14
Charles
2005-04-14
[email protected]
2005-04-15
Andrew Xiang
2005-04-15
Paolo Tassini
Adhesion for Al
Paolo Tassini
2005-04-15
I think that at this high rate you cannot have
a good control for the thickness of the layer!
For heat evaporation, better going for 1-5 A/s;
with e-beam we are esperiencing some problems for Al,
so I cannot give you details.
Paolo

> 10000 A in one min or approx 200 A sec
> Kind Regards
> Walter
> www.elume.com
>
> -----Original Message-----
> From: Andrew Xiang [mailto:[email protected]]
>
> What is a good evap or ebeam rate for depositing 1500A Al?
> Is it better to go slow or fast?1-10A/s or 50-100A/s?

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