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MEMSnet Home: MEMS-Talk: Dielectric fill material for deep trenches
Dielectric fill material for deep trenches
2005-05-16
Bob Henderson
2005-05-17
[email protected]
2005-05-17
[email protected]
Surface Stress & Cantilever
2005-05-17
Sudhanshu Garg
2005-05-18
Oliver Horn
2005-05-18
[email protected]
Dielectric fill material for deep trenches
[email protected]
2005-05-18
Oliver:
Thanks for the imput. Unfortunately, these are more like pillars so if we
oxidize them they shrink. The other problem is the stress that is generated
makes the wafer more like a potato chip after oxidization. I will let you know
what others had to say. Bob Henderson

-----Original Message-----
From: Oliver Horn 
Subject: Re: [mems-talk] Dielectric fill material for deep trenches

Hello Bob,

we filled a similar trench with thermal oxide. If you could produce the trench
smaller, because the oxide grows approximately half way in and half way out. So
if your trench could be 0.5 µm, this may work for you. The upper edge gets
normally round.
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