Hi,

I have a pad metallization consisting of 100nm Chromium and 300nm Gold. Both are
sputtered right after each other in vacuum. The problem is, that I need to etch
with 49%HF for a few minutes and the Cr-Au layer is practically lifted off the
siliconsubstrate. The Wafers were cleaned befor sputtering but have a native
oxide layer. Does anyone know a possibility to work with Cr-Au or another
metallization which withstands the HF? I need gold on top.

Thanks

Jan Grahmann
Siemens AG