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MEMSnet Home: MEMS-Talk: Polyimide Release Agent
Polyimide Release Agent
2005-05-26
erkin seker
2005-05-26
Oliver Horn
inquire about Parylene coating system?
2005-05-26
Xiaotong Gao
2005-05-27
mizur
2005-05-26
Dr Michael Cooke
2005-05-26
Michael D Martin
2005-05-27
MartinDümling
2005-05-26
[email protected]
2005-05-27
Philip Choi
2005-05-27
Michael D Martin
Polyimide Release Agent
Michael D Martin
2005-05-27
Yes, your right. I think polyimide has problems with strong bases. Though
I remember having adhesion issues while tring to do a wet anisotropic etch,
maybe the etchant was EDP. It occurs to me that one of our researchers here
had another interesting release technique. Apply and cure PI WITHOUT
adhesion promoter. Then just boil it in hot water. I believe it comes
right off.

-Mike Martin

>>> [email protected] 05/27/05 4:19 AM >>>
In our experiments Polyimide was attacked by KOH.
Martin
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