Hello

It seems from etching experiments (in di capacitive plasma
chamber), that I am not making good enough contact between
the substrate and the bottom electrode plate. Is there a
economical feasible way for doing so?

I think that using an adhesive might be a good idea to stick
the wafer directly to the aluminum electrode plate. But it
has to be both thermally and electrically conductive,
although electrically is more important. And it will has to
be able to withstand the high temperatures of the plasma (not
sure what the range is). Any recommended products to try?

thanks,
Xiaoyu