Hello,

I am trying to electroless plate nickel onto a 4 to 5 angstrom thick layer
of gold that was sputtered onto a silicon wafer covered with a layer of
silicon dioxide.  The nickel begins to adhere to the gold alright, but then
the gold layer curls up and peals off the silicon dioxide layer.  Any idea
what the problem is and how to fix it?

Sincerely,

Robert Dean
RF CMOS Designer
MEMS Optical
205 Import Circle
Suite 2
Huntsville, AL 35806
Tel. 256-859-1886
FAX 256-859-5890
email [email protected]