Hi,

First you need to deposit a conductive seed layer (Cr/Cu or Cr/Au)
inside these trenches for electrical contacts.After that you can start
the process.

You can choose pulse reverse electroplating as standard process.

Pradeep


On 8/24/05, J.J wang  wrote:
> Hi, Everyone,
> I am planning to electroplating copper on my mems
> device. The copper needs to fill up trench of 10 micon
> deep and 20 to 50 micron wide.
>
> But I have no prior experience of eplating. Can anyone
> give me some idea about how to setup the equippments,
> perform the procedure.
>
> Right now I have EPI E-Brite-Ultra Cu solution in
> hand.
>
> Any suggestion will be highly appreciated.
> Thanks.