Greetings,
You may want to consider another option, that  works extremely well, and
saves a lot of gold by not depositing,
only on the substrates were you want it ,but also depositing on all the
other surfaces and the  large area chamber.
If you have access to a RF/DC sputtering tool. it solves your problem using
a minimal amount of gold.
in  addition the final film is much denser, lower in resistivity,and better
sticking
Kind Regards
Walter
www.elume.com
 .


-----Original Message-----
From: Yves Bertic [mailto:[email protected]]
Sent: Friday, November 04, 2005 12:52 PM
To: General MEMS discussion
Subject: RE: [mems-talk] Defects in Gold evaporation in E-Beam evaporator

People indeed use Ta inside the crucible to prevent spitting. There is also
a paper by Feinstein which addresses this problem:

"Reduction of nodules in electron-gun-evaporated Au films", L.G. Feinstein
and M.J. Bill, J. Vac. Sci. Technol., Vol 12, No. 3, May/June 1975, p
704-708.

I have a copy if you are interested.

Yves Bertic