Hello all:
I have Si(100) wafers(thichness 425um) with 1um low stress silicon nitride
deposited.
I have etched my wafers with KOH(25% w.t., 80C) to get depth of ~360um. I
cleaned it with DI water and
sputtered 0.5um of TiW on backside of the wafer. Now I could see some stain
marks (clouds)
on TiW mostly near the edges. Does anyone have an idea what it could be?
Thanks a lot,
Jay M
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Jay Mehta
Graduate Research Assistant,
State University of New York,
Binghamton,
NY
Email: [email protected]
Phone: (732)-447-5329
