Dear all,

I am looking for a materail which can be used as a sacrificial layer
between Si or pyrex wafer and Si, and doesn't adhere to Su-8. Can
anyone give me a help on this?

detailedly, I want to deposit a layer (? material) on Si/pyrex
substrate, which will has good surface flatness and doesn't adhere to
SU-8, and then I bond them with another Si wafer, after several
process, the bottom Si wafer (with scrifical materal on it) can be
released from the top Si wafer.

It's better to have higher temperature tolerance, but around 250C is ok.

Teflon is a good candidate?

thanks a lot for your kind help!

Jing