I have got some questions regarding to anisotropic etching of  <100>
wafers
we are etching v-grooves on 4" <100> wafers.  there are some problems
about  silicon undercutting.
I heard that isopropyl alcohol may be added to reduce the undercutting.
but Isopropyl alcohol does not mix with water .
We are now using KOH+ D.I water etchant  and considering new method to
add  isopropyl alcohol.
I want to know the way to mix with isopropyl alcohol. we tried some
methods using stirrer etc but failed.
If you have a good method. please tell me the method as soon as
possible!