Hi,

I want to make a clamped spun on PI2611 membrane on a silicon wafer. I use
Cr to achieve good adhesion to bond the PI layer around the edge. I want
to blow up the membrane from a KOH etched opening at the wafer, which is
etched after PI is spun on and fullly cured. I need poor adhesion in
the center to blow up the clamped PI easily. Can someone give me
suggestions on what type of thin film (copper, polysilicon) is good for
this release layer? I have tried SiO2 and nitride. The results is still
not satisfactory so far.

Thanks!




Dongming He