To clarify: Aluminum is *not* attacked by XeF2.

                                -Zeke

>
> Aluminum is highly stressed and easily attacked.  Either alter the
> deposition method/rate/etc. to reduce stress or switch materials.  We make
> nickel structures with much success.
>
> --Jason Tauscher
>       Silicon Designs, Inc.
>       www.silicondesigns.com
>
> -----Original Message-----
> From: Robert Dean [mailto:rdean@memsoptical.com]
> Sent: Saturday, June 13, 1998 2:32 PM
> To: MEMS@ISI.EDU
> Subject: aluminum bowing
>
>
> Hello,
>
> I am trying to fabricate a suspended aluminum (99% Al, 0.5% Si, 0.5% Cu)
> structure, 1.15um thick on a silicon wafer.  The suspended length is
> approximately 130um.  After the structure is released etched from the
> silicon using XeF2, the aluminum bridge bows and twists due to stresses.
> What causes this and how can I prevent it?  Thank you.
>
> Sincerely,
>
> Robert Dean
> RF CMOS Designer
> MEMS Optical
> 205 Import Circle
> Suite 2
> Huntsville, AL 35806
> Tel. 256-859-1886
> FAX 256-859-5890
> email rdean@memsoptical.com
>
>
>
>
>