Hi,

we are working on such kind of profile. We are able to have
profiles from ~60 degrees up to 90.

SF6 and C4F8 is a good zero starting point to work on. We
have a paper at iMEMS06 Singapore on this issue.

best regards
At 03:09 PM 4/24/2006, you wrote:
>Hi,
>
>Is it possible to achive sloped side wall (profile angle varying from 70
>degree to 110 degree) with significant depth (~200-300 um) in DRIE process ?
>has any one has achieved such kind of sloped trenches ?
>
>I am trying to use BOSCH chemistry, playing with SF6, C4F8 flow rate and
>platen power , but resultant variation is only 1-2 degree. Has any one
>has experience in such case? Can i try only SF6 and O2 plasma (with out
>C4F8) ?
>
>I will thankful if any one can give some suggestion or can refer to some
>literature related to this challenging task.