Dear All,

I fabricated vias with tapered sidewalls (85- 87 degrees), 20 um in diameter and
a depth of 140 um. I am having problem Cu plating these vias because I have no
conformal Cu seed layer at the bottom and sidewalls of the vias. The Cu seed
layer is deposited using PECVD at a pressure of 5mTorr. Has anyone seen this
problem and how did you solve it?

Thanks for your help.

Isi