Hello All,

Does anyone have any information on SU-8 to PDMS bonding protocols and the
achievable bond quality (qualitative or quantitative)? I have microfluidic
channels fabricated in SU-8 on a glass substrate and I would like to seal
the channels with a PDMS lid. Some techniques I have read about include:

Thermal/Compression Bond:  anywhere from 95C to 200C for 30min to 2h under
compression (pressure unspecified).

Oxygen Plasma: anywhere from 50W to 200W for 1min to 5min, 20 to 60mTorr.

UV-Ozone Treatments: (no specific information available).

Though this question has been asked a few times in the last couple of years,
not many solutions were posted. I would be grateful to hear any suggestions,
including techniques which did not work.

Kind Regards,
Chris