Hi, I am doing Ni/Au on p-GaN as p-contact and Ti/Au as bondpad. But the whole
layer including Ni/Au and Ti /Au is always peeled off when I am doing wire
bonding. I think it is the adhesive problem between Ni/Au and p-GaN. Can you
give me suggestion ? By th way, I have tried Asher before depositionbut the
resistance is increased. So I hope to get rid of the ashing. Thanks.

Jie