Hi all,

  I am looking for technical information on the role of different depostion
parameters for sputtering/PVD systems on the properties of thin films. How can I
make the films thin or thick? What will be the effect of increasing or reducing
the pressure of Ar gas in nonreactive coat or N2 or C2H2 gas in reactive coat?
What will be the effect of bias and amperage or deposition time? etc etc...
  Can someone help me in this regard? I am also looking about the information
how these parameters can effect the color of the deposited films? Looking
forward to hear from you all. Thanks and regards.

  Mighauri