Message: 1

Date: Thu, 27 Jul 2006 08:01:58 -0700 (PDT)
From: nupur b 
Subject: [mems-talk] Au plating
To: [email protected]
Message-ID: <[email protected]>
Content-Type: text/plain; charset=iso-8859-1

HI Everybody,

  I'm trying to electroplate Au on the substrate. I have a seed layer of
gold on the substrate on Sio2. I'm using 10mA for a 1X1 cm sample.

  the gold solution is Aurofab BP and it heated and stirred during the
process. My problem is the surface looks very rough and somtimes the PR is
removed. I would really like some help.


Hi Nupur,

                  I am assuming that you are trying to plate the entire 1 x1
cm sample area. If so, by applying 10 mA you are running the plating at 10
ASF current density. Please check with the manufacturer of your plating
chemical if this is ok. Its sounds like a little too much. High ASF can lead
to rough film and localized heating which may be a reason for your PR
peeling off.


Saravana P. Natarajan
Grad. Research Assistant,
University of South Florida,Tampa, FL,