Hi,

Can't you just spin photoresist as the passivation
layer? It would be very uniform and can be patterned.


Tseng-Yang Hsu
Integrated Micromachines
[email protected]


-----Original Message-----
From: Mounir Ennabi 
To: [email protected] 
Date: Thursday, April 02, 1998 5:31 PM
Subject: dielectric passivation for interconnects?


>Dear group members
>Has anybody experience with dielectric passivation. I would like to
>cover homogeneously two metal interconnects with a dielectric layer in
>order to isolate them from the surrounding humid environment. These
>interconnects will be used in MCM's for through holes applications.
>The interconnects are 5mum high, and  PECVD-oxide doesn't offer a good
>stepcoverage. I have tried evaporated glass without good results.
>This dielectric layer has to be patterned in order to open contact holes
>to the metallines. So materials like Parylene (a polymer)is out of
>question (difficult to etch).
>Does anybody have a ready-to-use solution?
>
>                            regards.Mounir.
>
>Mikroelektronik Centret, building 345, room 154
>Technical University of Denmark, DK-2800 Lyngby.
>
>
>