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MEMSnet Home: MEMS-Talk: Evaporation of Silica
Plasma chamber
2006-08-29
amron gary
2006-08-29
Scott McWilliams
2006-08-29
David Henriks
2006-08-29
Bill Moffat
Evaporation of Silica
2006-08-30
Sreemanth M Uppuluri
2006-08-30
shay kaplan
hardbaked photoresist...
2006-08-30
Jan Michael Kubr
2006-08-30
Jack Mulligan
2006-08-30
Bill Flounders
2006-08-31
[email protected]
Evaporation of Silica
shay kaplan
2006-08-30
Sreemanth
You can get a uniform film by evap of silica on even larger sample. Hoever,
the film will have pinholes and defect in it. Any particle with diameter
larger than ~5nm that is there after sample prep or that get there during
pumping will result in a pinhole since the directional property of evap will
cause it no to be totally buried.

Shay

-----Original Message-----
From: [email protected] [mailto:[email protected]]
On Behalf Of Sreemanth M Uppuluri
Sent: ד 30 אוגוסט 2006 15:21
To: [email protected]
Subject: [mems-talk] Evaporation of Silica

Hello Everyone,

I am trying to coat silica films on my samples using e-beam evaporation. I
need a very thin coating (< 20 nm). I am wondering if this thickness is
adequate to ensure coverage over my entire sample (0.5" * 0.5"). Please let
me know if you have any pointers in this matter.
reply
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