Did you heat the substrate when doing O2 plasma? I've done hardbakes of 5740
(15 micron thick resist) for 2 hours at 170 C for DRIE. When that's done, I
throw it in O2 plasma and heat up to 175 C. At around 155 C the resist just
starts disappearing. By the time the substrate's up to 175 C, all of the
resist is gone.

Of course, if you don't have any RIE tool, just a barrel asher, then it's a
little hard to heat the substrate...

Good luck,

Mike

x1927
[email protected]

-----Original Message-----
From: Jan Michael Kubr [mailto:[email protected]]
Sent: Wednesday, August 30, 2006 1:44 PM
To: General MEMS discussion
Subject: [mems-talk] hardbaked photoresist...

I have a problem in that I cannot get hardbaked PR (SPR-220) of my
surfaces, both gold and Si.

With the gold sitting on TiW, piranha is not really a feasible solution.
I have tried long o2 plasma ashes and overnight baths in heated prs-3000
with little success.

Any other solutions I can try?

Sincerely,

Michael