Dear all
I'm using AZ926 photoressit for a thickness of 20um. However, after
hardbake (85 degree C for 20minutes), the photoresist reflows and does
not maintain the near vertical profile. I wonder if anybody knows
anyway to prevent the reflow of photoresist during the hardbake
process? Thanks a lot.

Leo

Electrical and Computer Engineering
Purdue University
[email protected]