Absolute answer is Sylilation, possible simple answer is vacuum bake.
Bill Moffat

-----Original Message-----
From: [email protected]
[mailto:[email protected]] On Behalf Of Xiaoguang "Leo" Liu
Sent: Thursday, August 31, 2006 3:25 PM
To: General MEMS discussion
Subject: [mems-talk] Photoresist Hard Bake question

Dear all
I'm using AZ926 photoressit for a thickness of 20um. However, after
hardbake (85 degree C for 20minutes), the photoresist reflows and does
not maintain the near vertical profile. I wonder if anybody knows anyway
to prevent the reflow of photoresist during the hardbake process? Thanks
a lot.

Leo

Electrical and Computer Engineering
Purdue University
[email protected]