I don't have experience with this resist or at that thickness, but I don't
think the resist should reflow at 85 C. You may try to ramp up to temp on
your hard bake, or maybe a Post exposure bake.

Robert

-----Original Message-----
From: [email protected] [mailto:[email protected]]
On Behalf Of Xiaoguang "Leo" Liu
Sent: Thursday, August 31, 2006 5:25 PM
To: General MEMS discussion
Subject: [mems-talk] Photoresist Hard Bake question

Dear all
I'm using AZ926 photoressit for a thickness of 20um. However, after
hardbake (85 degree C for 20minutes), the photoresist reflows and does
not maintain the near vertical profile. I wonder if anybody knows
anyway to prevent the reflow of photoresist during the hardbake
process? Thanks a lot.