For good thickness., you need to electroplate. For
good control over thickness (less thickness),u can do
either sputtering or evaporation.

For electroplating.,Ti or Cr Seed layer should be
either sputtered or evaporated.

Sputtering by e-beam should be better than thermal
evaporation as temp can be higher in the evaporation.

Regards

Bala


--- madhav rao  wrote:

> Hi all,
>       I am planning to deposit Nickel on silicon
> wafer. However im using PMMA patterning. Hence i
> need
> to do liftoff. Can u suggest a simpler way of
> depositing nickel such as sputtering or evaporation
> or
> electroplating. Let me know!!